A Novel Test Structure for Testing of ROIC for 2D Bolometric IR FPA

  • Raghvendra Sahai Saxena
  • Sushil Kumar Semwal
  • Nilima Singh
  • R. K. Bhan
Part of the Environmental Science and Engineering book series (ESE)

Abstract

We propose a novel test structure and the technique for testing the readout integrated circuit (ROIC) without fabricating microbolometers on it. In general, each ROIC cell has two ends that are connected with a microbolometer. We propose to use two additional metal lines in row-column configuration in such a way that all the ROIC cells have one of their ends connected to a row metal line and other end to the column metal line. With this configuration, an M × N test array will have only M + N nodes and easy testability of all MN cells by simply wire bonding M row pads with the M microbolometers fabricated separately as M × 1 linear array. Also, the non-uniformity within the row will represent the non-uniformity contributed only by the ROIC. Therefore, fixed pattern noise (FPN) in the ROIC alone may also be tested by this method.

Keywords

OTFT Mobility and threshold voltage 

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Notes

Acknowledgments

The authors are thankful to the analog VLSI design team of ANURAG, Hyderabad for their help in the implementation of the proposed idea no actual Si. The authors also want to thank Director SSPL, Dr. R. Muralidharan, for encouragement and support to carry out this work and granting permission to publish it.

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Copyright information

© Springer International Publishing Switzerland 2014

Authors and Affiliations

  • Raghvendra Sahai Saxena
    • 1
  • Sushil Kumar Semwal
    • 1
  • Nilima Singh
    • 1
  • R. K. Bhan
    • 1
  1. 1.Solid State Physics LaboratoryDelhiIndia

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