Abstract
A temperature controlled tensile testing was performed to investigate the influence of external stress on the growth of an interfacial Cu-Sn IMC layer. The test specimens were prepared by depositing 25 μm layers of tin atop of copper substrate using electroplating. Samples were then clamped in a micromechanical testing apparatus integrated with a furnace. Experiments were carried out using load feedback control to provide constant load on the specimens with the stress level of 50, 100 and 150 MPa under constant temperature at 200 °C for 3–5 h annealing. Comparisons were made between samples undergoing stresses and those without stresses annealing. We observed the influence of stress levels and aging time on the formation of intermetallic compounds (IMC). Stress does influence the formation of Cu/Sn IMC. The thickness of IMC increased under stress. The growth rate of IMC was faster in stressed tin samples. Moreover, the formation of IMC micrographic structures under external stress differs considerably according to the level of stress.
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Tu KN (1973) Interdiffusion and reaction in bimetallic Cu-Sn thin films. Acta Metall 21:347–354
Rymaszewski EJ, Tummala RR, Watari T (1997) Microelectronic packaging handbook, Part I, 2nd edn. Chapman and Hall, Springer US
Harper CA (2005) Electronic packaging and interconnection handbook. McGraw-Hill, New York
Zarrow P (1999) On the forefront: lead free: don’t fight a fact, deal with it! Circ Assem 10:18–20
Snog JY, Jin Yu, Lee TY (2004) Effects of reactive diffusion on stress evolution in Cu–Sn films. Scripta Meterialia 51:167–170
Ngoh SL, Zhou1 W, Pang1 HL, Spowage AC, Shi XQ (2004) Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu Lead-free solder joint on Au/Ni/Cu substrate. Electronics packaging technology conference, Singapore
King-Ning Tu (2007) Solder joint technology. Springer, New York
Huh JY, Moon SJ (2000) Effect of elastic stresses on solid-state amorphization of Zr/Co multilayers. Thin Solid Films 377–378:611–616
Mulugeta Abtew, Selvaduray G (2000) Lead-free solder in microelectronics. Mater Sci Eng 27:95–141
Daniel L, Wong CP (2009) Material for advanced packaging. Springer, New York
Görlich J, Schmitz G, Tu KN (2005) On the mechanism of the binary Cu/Sn solder reaction. J Appl Phys Lett 86:053106-1–053106-3
Kakeshita T, Shimizu K, Kawanaka R et al (1982) Grain size effect of electro-plated tin coatings on whisker growth. J Mater Sci 17:2560–2566
Lee Z, Lee DN (1998) Spontaneous growth mechanism of tin whisker. Acta Metal 46:3701–3714
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© 2014 The Society for Experimental Mechanics
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Hsu, FC., Lu, FC., Huang, CT., Lin, MT. (2014). Temperature Dependent Micromechanical Testing on the Formation of Cu/Sn Intermetallic Thin Films. In: Shaw III, G., Prorok, B., Starman, L., Furlong, C. (eds) MEMS and Nanotechnology, Volume 5. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-319-00780-9_13
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DOI: https://doi.org/10.1007/978-3-319-00780-9_13
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