SEM-DIC Based Nanoscale Thermal Deformation Studies of Heterogeneous Material
Full-field thermal deformation experiments on electronic packaging materials for areas from 50 × 50 to 10 × 10 μm2 and temperatures from RT to ≈200 °C have been successfully performed in a Zeiss Ultraplus Thermal Field Emission SEM using 2D-DIC. First, polishing methods for heterogeneous electronic packages containing silicon, Cu bump, dielectric layer, substrate and FLI (First level interconnect) have been studied to achieve sub-micron surface flatness. Using novel self-assembly techniques, a dense, randomly isotropic high contrast pattern has been successfully applied over the surface of test samples. A high precision Physik Instrumente (PI) Piezo nanopositioning stage has been used to help implement essential drift and spatial distortion correction procedures, which were recently shown to be effective in removing distortions from SEM images. Using thin ceramic films to reduce thermal effects on the FEG SEM source, results indicate that the method is capable of measuring local thermal expansion in selected regions, improving our understanding of these heterogeneous material systems under controlled thermal environmental conditions.
KeywordsSEM DIC Thermal deformation Heterogeneous material Evolution of deformation
- 3.Sutton MA, Li N, Garcia D, Cornille N, Orteu JJ, McNeill SR, Schreier HW, Li X, Reynolds AP (2007) Scanning electron microscopy for quantitative small and large deformation measurements part II: experimental validation for magnifications from 200 to 10,000. Exp Mech 47:789–804. doi:10.1007/s11340-007-9041-0 CrossRefGoogle Scholar
- 5.Sutton MA, Orteu JJ, Schreier HW (2009) Image correlation for shape, motion and deformation measurements, ISBN 978-0-387-78746-6. Springer, New YorkGoogle Scholar
- 6.Kammers AD, Daly S (2013) Self-assembled nanoparticle surface patterning for improved digital image correlation in a scanning electron microscope. Exp Mech. doi:10.1007/s11340-013-9734-5