Time-to-Failure Modeling

  • J. W. McPherson


All materials tend to degrade, and will eventually fail, with time. For example, metals tend to creep and fatigue; dielectrics tend to trap charge and breakdown; paint tends to crack and peel; polymers tend to lose their elasticity and become more brittle, teeth tend to decay and fracture; etc. All devices (electrical, mechanical, electromechanical, biomechanical, bioelectrical, etc.) will tend to degrade with time and eventually fail.


Flux Divergence Stress Dependence Breakdown Strength High Stress Condition Accelerate Stress 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


  1. McPherson, J.: Stress Dependent Activation Energy, IEEE International Reliability Physics Symposium Proceedings, 12(1986).Google Scholar
  2. McPherson, J. and E. Ogawa: Reliability Physics and Engineering. In: Handbook of Semiconductor Manufacturing Technology, 2nd Edition, CRC Press 30-1(2008).Google Scholar

Copyright information

© Springer International Publishing Switzerland 2013

Authors and Affiliations

  1. 1.McPherson Reliability Consulting, LLCPlanoUSA

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