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Heat Generation and Dissipation

  • J. W. McPherson
Chapter

Abstract

The adverse impact of temperature on device/material reliability has been emphasized often in this book. The degradation rate for most devices/materials tends to accelerate exponentially with increasing temperature. Therefore, for reliability reasons, lower temperature device operation is usually preferred. However, many devices (both electrical and mechanical) can generate significant amounts of heat as they are being operated. Once device operation begins, the rate of increase in temperature of the device/material will depend upon on the heat generation within the device, the heat capacity of the materials, and the heat dissipation from the device to the heat sink (which is often the ambient).

Keywords

Heat Sink Metal Plate Heat Generation Rate Heat Dissipation Rate Constant Input Power 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Bibliography

  1. Arpacz, V., Conduction Heat Transfer, Addison-Wesley Publishing, 1966.Google Scholar
  2. Carslaw, H. and J. Jaeger, Conduction of Heat in Solids, 2nd Ed., Oxford Press, 1959.Google Scholar
  3. Kittel, C. and H. Kroemer, Thermal Physics, 2nd Ed., W.H. Freeman and Co., 1980.Google Scholar
  4. Sears, F and G. Salinger, Thermodynamics, Kinetic Theory, and Statistical Thermodynamics, 3rd Ed., 1975.Google Scholar
  5. Thomas, L., Fundamentals of Heat Transfer, Prentice-Hall Inc., 1980.Google Scholar

Copyright information

© Springer International Publishing Switzerland 2013

Authors and Affiliations

  1. 1.McPherson Reliability Consulting, LLCPlanoUSA

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