Abstract
The solder joint reflow process exposes the test assembly with BGA solders and/or printed solder paste to prescribed temperature profiles resulting in complete melting, wetting and flowing of the molted solder. During reflow cooling, the solder solidifies, making up the solder joint. Higher reflow temperature also activates a chemical reaction at the solder/pad interface, resulting in the formation of a thin intermetallic layer that improves the strength of the interface. The large temperature difference between solder reflow and ambient conditions induces thermal strains and stresses in the solder joint due to mismatches in the coefficient of thermal expansion (CTE) among the different materials making up the assembly. Thus, a thorough understanding of the evolution of internal states in the solder joint is essential in mitigating the residual stresses in the solder joints and ensuring high reliability of the assembly. In this respect, finite element (FE) simulation with an appropriate model for the geometry of the assembly and suitable material models can be employed to describe the mechanics of the materials during the solder joint reflow cooling process.
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Tamin, M.N., Shaffiar, N.M. (2014). Application I: Solder Joint Reflow Process. In: Solder Joint Reliability Assessment. Advanced Structured Materials, vol 37. Springer, Cham. https://doi.org/10.1007/978-3-319-00092-3_5
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DOI: https://doi.org/10.1007/978-3-319-00092-3_5
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