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Construction of Multidimensional and Dynamic College Students’ Innovation and Entrepreneurship Platform Based on School-Enterprise Cooperation

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Application of Big Data, Blockchain, and Internet of Things for Education Informatization (BigIoT-EDU 2022)

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Abstract

The development of higher education in China is gradually adapting to the development of market and society. On this basis, a new talent training mode of school enterprise cooperation is proposed, which is also consistent with the demand for innovative and entrepreneurial talents in the new era. This study aims to explore the relationship between academic achievement, self-concept, motivation and entrepreneurial intention. The research question is: what is the relationship between high school students’ academic achievement (academic achievement), self-concept (self-esteem), motivation (entrepreneurial intention) and entrepreneurial intention? Are there significant differences between these variables among high school students with different academic levels? This paper mainly discusses the construction.

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References

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Authors and Affiliations

  1. The First Hospital Affiliated with the Chinese Medical University, Shenyang, 110001, Liaoning, China

    Tianyi Sun & Lei Sun

Authors
  1. Tianyi Sun
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  2. Lei Sun
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Correspondence to Tianyi Sun .

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Editors and Affiliations

  1. Department of Computer Science, Abdul Wali Khan University Mardan, Mardan, Pakistan

    Mian Ahmad Jan

  2. Department of Computer Science, Abdul Wali Khan University Mardan, Mardan, Pakistan

    Fazlullah Khan

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© 2023 ICST Institute for Computer Sciences, Social Informatics and Telecommunications Engineering

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Sun, T., Sun, L. (2023). Construction of Multidimensional and Dynamic College Students’ Innovation and Entrepreneurship Platform Based on School-Enterprise Cooperation. In: Jan, M.A., Khan, F. (eds) Application of Big Data, Blockchain, and Internet of Things for Education Informatization. BigIoT-EDU 2022. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, vol 467. Springer, Cham. https://doi.org/10.1007/978-3-031-23944-1_37

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  • DOI: https://doi.org/10.1007/978-3-031-23944-1_37

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-031-23943-4

  • Online ISBN: 978-3-031-23944-1

  • eBook Packages: Computer ScienceComputer Science (R0)

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