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Microstructure and Property Characterization of AM Materials

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Springer Handbook of Additive Manufacturing

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Abstract

Layer-by-layer addition of material in additive manufacturing methods inherently develops a peculiar microstructure and defect structure in additive manufactured components. The microstructure is characterized by epitaxial grain growth in the build-direction. Naturally, this also leads to peculiar mechanical properties. In order to understand the interrelationship between additive manufacturing process parameters, defects and microstructure, and mechanical properties, the additive manufactured components have to be characterized using microscopy and mechanical testing techniques. This section provides an overview of feedstock characterization techniques, microscopy techniques, and mechanical property characterization techniques in the context of additive manufacturing.

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Authors and Affiliations

  1. Reverb Industrial, Inc., San Diego, CA, USA

    Anagh Deshpande

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  1. Anagh Deshpande
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Correspondence to Anagh Deshpande .

Editor information

Editors and Affiliations

  1. College of Engineering, Design and Physical Sciences, Brunel University London, Uxbridge, UK

    Eujin Pei

  2. Lab. for Digital Sciences of Nantes, École Centrale de Nantes, NANTES CEDEX 3, France

    Alain Bernard

  3. CMST, Nanjing University of Aeronautics and Astronautics, Nanjing, China

    Dongdong Gu

  4. Karlsruhe Institut of Technology KIT, Karlsruhe, Germany

    Christoph Klahn

  5. Dept. Mechanical Engineering, University of Las Palmas de Gran Canaria, Las Palmas de Gran Canaria, Las Palmas, Spain

    Mario Monzón

  6. University of Bremen, Bremen, Germany

    Maren Petersen

  7. Materials Science & Engineering, University of Virginia, Charlottesville, VA, USA

    Tao Sun

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Deshpande, A. (2023). Microstructure and Property Characterization of AM Materials. In: Pei, E., et al. Springer Handbook of Additive Manufacturing. Springer Handbooks. Springer, Cham. https://doi.org/10.1007/978-3-031-20752-5_43

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  • DOI: https://doi.org/10.1007/978-3-031-20752-5_43

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-031-20751-8

  • Online ISBN: 978-3-031-20752-5

  • eBook Packages: EngineeringEngineering (R0)

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