Abstract
Recycling obsolete electronic devices (E-waste) is a dangerous task for human workers. Automated E-waste recycling is an area of great interest but challenging for current robotic applications. We focus on the problem of segmenting inner parts of E-waste devices into manipulable elements. First, we extend a dataset of hard-drive disk (HDD) components with labelled occluded and non-occluded points of view of the parts, in order to increase the diversity and the quality of the learning data with different angles. We then perform an extensive evaluation with three different state-of-the-art models, namely CenterMask, BlendMask and SOLOv2 (including variants) and two types of metrics: the average precision as well as the frame rate. Our results show that instance segmentation using state-of-the-art deep learning methods can precisely detect complex shapes along with their boundaries, as well as being suited for fast tracking of parts in a robotic recycling system.
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We acknowledge the European Union’s Horizon 2020 program for the grant agreement no. 731761 (IMAGINE).
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Rojas, C., Rodríguez-Sánchez, A., Renaudo, E. (2022). Deep Learning for Fast Segmentation of E-waste Devices’ Inner Parts in a Recycling Scenario. In: El Yacoubi, M., Granger, E., Yuen, P.C., Pal, U., Vincent, N. (eds) Pattern Recognition and Artificial Intelligence. ICPRAI 2022. Lecture Notes in Computer Science, vol 13363. Springer, Cham. https://doi.org/10.1007/978-3-031-09037-0_14
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