Abstract
Once all the circuits have been designed and simulated, the next step is board layout. This is one of the most critical steps in the development process because the effectiveness of the circuits designed depends on where the components are placed relative to the DSP/CPU pins and the traces that are being routed to those pins. Also, the board layout has a big effect on noise, crosstalk, and transmission line effects so optimizing the layout can minimize these effects. This chapter covers the printed circuit board stackup, routing guidelines, and layout techniques for low noise and EMI.
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References
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Signal Integrity (SI) in High-Speed PCB Designs, Intel Corporation, ID: 683864, 18 Mar 2021
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Tran, T.T. (2023). Printed Circuit Board (PCB) Layout. In: High-Speed System and Analog Input/Output Design . Springer, Cham. https://doi.org/10.1007/978-3-031-04954-5_14
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DOI: https://doi.org/10.1007/978-3-031-04954-5_14
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