Abstract
Pressure sensors are present since the very beginning of the MEMS history, and they have featured an important technological development. In this chapter, an overview of the evolution of the technology will be presented, with a primary focus on piezoresistive and capacitive technologies. Key figures of both technologies will be introduced, with a comparison of the advantages and disadvantages between them. Moreover, the key technological modules of ST pressure sensors will be introduced: The VENSEN technology, which enables the large-scale fabrication of monocrystalline silicon membranes above an air cavity; or the BASTILLE technology, which suspends the pressure sensing element with an architecture based on springs to decouple it mechanically from package-related stress.
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References
Smith, C. S. (1954). Piezo resistance Effect in Germanium and Silicon. Physics Review, 94(1), 42–49.
Chollet, F., & Liu, HB, “A (not so) short Introduction to Micro Electromechanical Systems,” version 5.4, 2018., http://memscyclopedia.org/introMEMS.html
Kulite, “Celebrating Fifty Years”, http://www.kulitesensors.com.cn/reference/KuliteHistory.pdf
Tufte, O. N., Chapman, P. W., & Long, D. (1962). Silicon diffused-element piezoresistive diaphragms. Journal of Applied Physics, 33, 3322.
Hatanaka, K., Sim, D. Y., Minami, K., & Esashi, M., “Silicon diaphragm capacitive vacuum sensor”, in Tech. Dig. 13th Sensor symp., 1995, pp. 37–40.
Kanda, Y., “A graphical representation of the piezoresistance coefficients in silicon”, IEEE Trans Electron Devices. 1982; 29:64–70. [Google Scholar].
Price, J., “Anisotropic etching of silicon with KOH-H2O isopropyl alcohol", ECS semiconductor silicon, pp. 339–353 (1973).
Jackson, T., Tischler, M. A., & Wise, K. D. (1981). An Electrochemical P-N Junction Etch-Stop for the Formation of Silicon Microstructures. IEEE Electron Device Letters, EDL-2(2), 44–45.
Barlocchi, G., Corona, P., Faralli, D., & Villa, F. F. (2005). Method for forming buried cavities within a semiconductor body, and semiconductor body thus made. US Patent, 7, 811–848.
Armbruster, S., Schäfer, F., Lammel, G., Artmann, H., Schelling, C., Benzel, H., Finkbeiner, S., Lärmer, F., Ruther, P., Paul, O. (2003). A novel micromachining process for the fabrication of monocrystalline Si-membranes using porous silicon. In: Proceedings of 12th international conference on solid-state sensors, actuators, and microsystems, Boston, pp 246–249.
Duqi, E., Baldo, L., Urquia, M. A., & Allegato, G. (2019). A Piezoresistive Mems Barometer with Thermomechanical Stress Rejection. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) (pp. 659–662). Berlin, Germany. https://doi.org/10.1109/TRANSDUCERS.2019.8808357.
Richter, J., Pedersen, J., Brandbyge, M., Thomsen, E. V., & Hansen, O. (2008). Piezoresistance in p-type silicon revisited. Journal of Applied Physics, 104(2), 023715.
Doll, J. C., & Pruitt, B. L. (2013). Piezoresistor Design and Applications (1st ed.). New York, NY, USA: Springer.
Kumar, S. S., & Pant, B. D. (2014). Design principles and considerations for the ‘ideal’ silicon piezoresistive pressure sensor: a focused review. Microsystem Technologies, 20, 1213–1247. https://doi.org/10.1007/s00542-014-2215-7.
Eaton, W. P., & Smith, J. H. (1997). Micromachined pressure sensors: review and recent developments. Smart Mater. Structure, 6(5), 530.
Cho, S. T., Najafi, K., & Wise, K. D. (1990). Secondary sensitivities and stability of ultrasensitive silicon pressure sensors. In Technical Digest, IEEE Solid-State Sensor and Actuator Workshop (pp. 184–187). Hilton Head ‘90.
Zhang, Y., & Wise, K. D. (1994). An ultra-sensitive capacitive pressure sensor with a bossed dielectric diaphragm. In Technical Digest, Solid-State Sensor and Actuator Workshop (pp. 205–208). Hilton Head ‘94.
Baldo, L., Duqi, E., & Villa, F. (2015). Micro-electro-mechanical device and manufacturing process thereof. US Patent, US10150666B2.
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Duqi, E., Allegato, G., Azpeitia, M. (2022). Pressure Sensors. In: Vigna, B., Ferrari, P., Villa, F.F., Lasalandra, E., Zerbini, S. (eds) Silicon Sensors and Actuators. Springer, Cham. https://doi.org/10.1007/978-3-030-80135-9_16
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DOI: https://doi.org/10.1007/978-3-030-80135-9_16
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