Abstract
Wafer-to-wafer bonding techniques are widely used in the semiconductor industry to create a range of complex devices which are now used in many industrial, consumer, and automotive applications.
In the following chapter, the main bonding techniques utilized in MEMS components are described and some study cases presented.
In Sects. 11.2 and 11.3, a summary of permanent and temporary bonding methods are introduced with the description of the main industrial materials used for both techniques: all the bonding methods such as eutectic, glassfrit, polymer based, and fusion are presented. Moreover, in Sect. 11.4, a detailed description of the most widely employed nondestructive and destructive methods to characterize wafer bonding is discussed, such as Scanning Acoustic Microscope (SAM) and Infra-Red (IR) as well as pull, shear and micro-chevron tests, and Mazdara method.
Glass frit bonding characterization is presented (11.6.1) applied to accelerometers and gyroscopes showing the main challenges of this technique.
Thermocompression Au–Au and an eutectic AlGe study cases are also described in Sects. 11.6.2 and 11.6.3 for accelerometer and pressure sensor products, respectively.
In Sect. 11.6.4, permanent bonding using a polymer adhesive is described underlying the main difficulty to coat the substrate when topography and device features prevent usage of standard methods.
Finally, a deep description of temporary bonding and a study case to realize a micromirror device is presented (11.7) focusing on thermoplastic and tape materials used to obtain such peculiar structures.
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Oggioni, L., Garavaglia, M., Seghizzi, L. (2022). Wafer-to-Wafer Bonding. In: Vigna, B., Ferrari, P., Villa, F.F., Lasalandra, E., Zerbini, S. (eds) Silicon Sensors and Actuators. Springer, Cham. https://doi.org/10.1007/978-3-030-80135-9_11
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DOI: https://doi.org/10.1007/978-3-030-80135-9_11
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