Skip to main content
  • 1022 Accesses

Abstract

GaN HEMTs suffer from charge-trapping effects. The charge-trapping affects behavior of both RF and power GaN devices. These are complex phenomenon, and the modeling of these effects is further complicated by the needs and approximations made to develop such models. Models for trapping effects in GaN HEMTs in ASM-HEMT model are discussed here.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

eBook
USD 16.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 16.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 129.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Notes

  1. 1.

    An acceptor trap center is a trap center which is neutral when all the energy levels of the trap center are empty, and negatively charged and, therefore, ionized, when one or more energy levels of the trap center are occupied by electrons.

  2. 2.

    A donor trap center is a trap center that is neutral when all the energy levels of the trap center are occupied by electrons, and positively charged and, therefore, ionized, when one or more energy levels of the trap center are empty.

  3. 3.

    Consider, for instance, a sheet of trap centers. Let be the cross-sectional area perpendicular to the direction of the “injected” current. The currents I n and I p are related to n J and p J by and , where and are the drift velocities of the injected electrons and holes, respectively.

References

  1. Joh, J., Del Alamo, J.A.: IEEE Trans. Electron Devices 58(1), 132 (2010)

    Google Scholar 

  2. Jin, D., del Alamo, J.A.: In: Proceedings of the 2012 24th International Symposium on Power Semiconductor Devices and ICs, pp. 333–336. IEEE, New York (2012)

    Google Scholar 

  3. Couvidat, J., Subramani, N.K., Gillet, V., Laurent, S., Charbonniaud, C., Nallatamby, J.C., Prigent, M., Deltimple, N., Quéré, R.: In: Proceedings of the 2018 IEEE/MTT-S International Microwave Symposium-IMS, pp. 720–723. IEEE, New York (2018)

    Google Scholar 

  4. Bouya, M., Malbert, N., Labat, N., Carisetti, D., Perdu, P., Clément, J.C., Lambert, B., Bonnet, M., Microelectron. Reliab. 48(8–9), 1366 (2008)

    Google Scholar 

  5. Bisi, D., Meneghini, M., Van Hove, M., Marcon, D., Stoffels, S., Wu, T.L., Decoutere, S., Meneghesso, G., Zanoni, E.: Phys. Status Solidi A 212(5), 1122 (2015)

    Google Scholar 

  6. Rathmell, J.G., Parker, A.E.: In: Microelectronics: Design, Technology, and Packaging III, Proceedings of SPIE Conference on Microelectronics, MEMS and Nanotechnology, vol. 6798, pp. 67980R(1–11). Canberra, Australia (2007). https://doi.org/10.1117/12.758711

  7. Albahrani, S.A., Parker, A.E., Heimlich, M.: In: Solid-State Electron. 126, 143–151 (2016)

    Google Scholar 

  8. Khandelwal, S., Chauhan, Y.S., Fjeldly, T.A., Ghosh, S., Pampori, A., Mahajan, D., Dangi, R., Ahsan, S.A.: Manuscript submitted to IEEE Trans. Electron Devices

    Google Scholar 

  9. Shockley, W., Read, W.T., Phys. Rev. 87(5), 835 (1952). https://doi.org/10.1103/PhysRev.87.835

  10. Sah, C.: Proc. IEEE 55(5), 654 (1967). https://doi.org/10.1109/PROC.1967.5630

Download references

Author information

Authors and Affiliations

Authors

Rights and permissions

Reprints and permissions

Copyright information

© 2022 Springer Nature Switzerland AG

About this chapter

Check for updates. Verify currency and authenticity via CrossMark

Cite this chapter

Khandelwal, S. (2022). Trapping Models. In: Advanced SPICE Model for GaN HEMTs (ASM-HEMT). Springer, Cham. https://doi.org/10.1007/978-3-030-77730-2_6

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-77730-2_6

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-77729-6

  • Online ISBN: 978-3-030-77730-2

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics