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Reliability Challenges in FinFETs

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Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs

Abstract

The technology scaling and the adoption of FinFET devices brought several benefits, but some drawbacks were also introduced at each technology node. This chapter starts by providing a general overview of the problems that affect the reliability of integrated circuits. Then, we present the two reliability challenges addressed in this book: process variability and radiation-induced soft errors. The second section is dedicated to explaining the meaning of process variability, how it affects the electronic systems, and the main sources of process variations. The third section explores the impact of radiation effects on circuits, the classification of single event effects, and the charge collection mechanism. Finally, the most relevant state-of-the-art works are presented, focusing on evaluating or attenuating nanometer technologies reliability challenges

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Authors and Affiliations

  1. Universidade Católica de Pelotas, Pelotas, Rio Grande do Sul, Brazil

    Alexandra Zimpeck

  2. Universidade Federal de Santa Catarina, Florianópolis, Santa Catarina, Brazil

    Cristina Meinhardt

  3. ONERA/DPHY University of Toulouse, Toulouse, France

    Laurent Artola

  4. Inst de Informatica, Bloco IV, CP15064, Univ Federal do Rio Grande do Sul, Porto Alegre, Rio Grande do Sul, Brazil

    Ricardo Reis

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  1. Alexandra Zimpeck
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  3. Laurent Artola
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  4. Ricardo Reis
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Zimpeck, A., Meinhardt, C., Artola, L., Reis, R. (2021). Reliability Challenges in FinFETs. In: Mitigating Process Variability and Soft Errors at Circuit-Level for FinFETs. Springer, Cham. https://doi.org/10.1007/978-3-030-68368-9_3

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