Skip to main content

DIC-IR Analysis of Transient Thermal Stresses

  • 266 Accesses

Part of the Conference Proceedings of the Society for Experimental Mechanics Series book series (CPSEMS)

Abstract

This paper shows the feasibility of determining transient thermal strains and stresses using simultaneous time-dependent full-field temperature and displacement measurements along the surface of simple and complex structures. Temperature and displacements were experimentally determined by a set-up composed of a thermographic infrared (IR) micro-bolometer camera coupled to a stereo Digital Image Correlation (DIC) system. A polycarbonate flat disc-shaped specimen was tested under transient thermal inputs. The thermal expansion coefficient of polycarbonate was also measured using the same experimental set up. The mechanical or net strain distributions were determined from the total or gross DIC measured strains by subtracting the free induced temperature strains. The final strain distributions were compared with analytical and finite element solutions determined by using the IR test-measured temperature distributions.

Keywords

  • Digital Image correlation
  • Thermography
  • Thermal Strain
  • Time dependent

This is a preview of subscription content, access via your institution.

Buying options

Chapter
EUR   29.95
Price includes VAT (Finland)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
EUR   160.49
Price includes VAT (Finland)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
EUR   219.99
Price includes VAT (Finland)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
EUR   219.99
Price includes VAT (Finland)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Learn about institutional subscriptions
Fig. 11.1
Fig. 11.2
Fig. 11.3
Fig. 11.4
Fig. 11.5
Fig. 11.6

References

  1. Miskioglu, I., Burger, C.P.: Photothermoelastic analysis of transient thermal stresses. Exp. Mech., 89–95 (1982)

    Google Scholar 

  2. Costa, F.M.S., Freire, J.L.F., Rudolph, J., Maneschy, J.E.: A proposal to consider cycle counting methods for fatigue analysis of nuclear and conventional power plant components. Proceedings of PVP 2016, Paper No. PVP 2016-63931, ASME Pressure Vessels & Piping Conference, July 17–21, Vancouver, BC, CA (2016)

    Google Scholar 

  3. Yoneyama, S., Arikawa, S., Kurosu, Y.: Evaluating thermal stresses and strains from measured displacements using an experimental-numerical hybrid method. Proceedings of the 2015 Society for Experimental Mechanics Conference on Experimental and Applied Mechanics, SEM, Costa Mesa, CA, EUA (2015)

    Google Scholar 

  4. Fukuda, Y., Koyanagi, J., Hirai, K., Yoshimura, A., Aoki, T., Ogasawara, T., Yoneyama, S.: Measurement of thermal deformation of CFR Punder rapid heating. Proceedings of the 2015 Society for Experimental Mechanics Conference on Experimental and Applied Mechanics, SEM, Costa Mesa, CA, EUA (2015)

    Google Scholar 

  5. Jones, E., Iadicola, M.: A Good Practices Guide for Digital Image Correlation. International Digital Image Correlation Society (2018)

    Google Scholar 

  6. Kovalenko, A.D.: Thermoelasticity, Basic Theory and Application. Wolters-Noordfoff Publishing, Groningen (1969)

    MATH  Google Scholar 

  7. ANSYS, Inc: ANSYS Advanced Analysis Techniques Guide. Ansys Help (2007)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to J. L. F. Freire .

Editor information

Editors and Affiliations

Appendices

Appendices

Elasticity equations for a hollow thin disk under thermal loading [6].

$$ {\sigma}_r=\frac{\alpha_TE}{r^2}\left[\frac{r^2-{r}_1^2}{r_2^2-{r}_1^2}\underset{r_1}{\overset{r_2}{\int }}\left(T-{T}_o\right) rdr-\underset{r_1}{\overset{r}{\int }}\left(T-{T}_o\right) rdr\right] $$
$$ {\sigma}_{\theta }=\frac{\alpha_TE}{r^2}\left[\frac{r^2+{r}_1^2}{r_2^2-{r}_1^2}\underset{r_1}{\overset{r_2}{\int }}\left(T-{T}_o\right) rdr+\underset{r_1}{\overset{r}{\int }}\left(T-{T}_o\right) rdr-\left(T-{T}_o\right){r}^2\right] $$
$$ {\varepsilon}_r=\frac{1}{E}\left({\sigma}_r-\nu {\sigma}_{\theta}\right)+{\alpha}_T\left(T-{T}_o\right) $$
$$ {\varepsilon}_{\theta }=\frac{1}{E}\left({\sigma}_{\theta }-\nu {\sigma}_r\right)+{\alpha}_T\left(T-{T}_o\right) $$

= initial temperature; r1 = a; r2 = b; E = Young modulus; ν = Poisson’s coefficient, α = thermal expansion coefficient

Finite element axisymmetric solution [7].

The finite element linear-elastic axisymmetric solution employed the software ANSYS® version 18.1 and used a Poisson’s coefficient μ = 0.36. Tests using different values of μ (from 0.32 to 0.38) showed to cause negligible influence in the numerical and analytic solutions. The applied boundary conditions consisted of zero radial stresses along the internal hole and external disc surfaces. The heating problem was treated as static. A thermal condition was applied to simulate the temperature distribution, obtained from the IR measurement, along the radius of the disc (from r = a to r = b). The model mesh consisted of 9535 SOLID186 elements and a total of 29,308 nodes.

Rights and permissions

Reprints and Permissions

Copyright information

© 2021 The Society for Experimental Mechanics, Inc.

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

González, J.A.O., Paiva, V.E.L., Gonzáles, G.L.G., Freire, J.L.F., Miskioglu, I. (2021). DIC-IR Analysis of Transient Thermal Stresses. In: Kramer, S.L., Tighe, R. (eds) Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, Volume 7. Conference Proceedings of the Society for Experimental Mechanics Series. Springer, Cham. https://doi.org/10.1007/978-3-030-59864-8_11

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-59864-8_11

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-59863-1

  • Online ISBN: 978-3-030-59864-8

  • eBook Packages: EngineeringEngineering (R0)