Skip to main content
SpringerLink
Log in

Nano-conductive Adhesives for Nano-electronics Interconnection

  • Chapter
  • First Online:
Nano-Bio- Electronic, Photonic and MEMS Packaging

  • 702 Accesses

Abstract

With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as one of the environmentally friendly alternatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nano-conductive adhesives are becoming more and more important due to the special electrical, mechanical, optical, magnetic, and chemical properties that nano-sized materials can possess. There has been extensive research for the last few years on materials and process improvement of ECAs, as well as the advances of nano-conductive adhesives that contain nano-filler such as nanoparticles, nanowires, or carbon nanotubes and nanomonolayer graphenes. In this chapter, recent research trends on electrically conductive adhesives (ECAs) and their related nanotechnologies are discussed, with the particular emphasis on the emerging nanotechnology, including materials development and characterizations, processing optimization, reliability improvement, and future challenges/opportunities identification. The state of the art on nanoisotropic/anisotropic conductive adhesives incorporated with nano-silver, carbon nanotubes, and nanonickel and their recent studies on those for flexible nano-/bioelectronics, transparent electrodes, and jettable processes are addressed in this chapter. Future studies on nanointerconnect materials are discussed as well.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 149.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 199.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 279.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

References

  1. Wolfson, H., Elliot, G.: Electrically conducting cements containing epoxy resins and silver. US Patent. 2(774), 747 (1956)

    Google Scholar 

  2. Matz, K.R.: Electrically conductive cement and brush shunt containing the same. US Patent. 2(849), 631 (1958)

    Google Scholar 

  3. Beck, D.P.: Printed electrical resistors. US Patent 2,866,057, 1958

    Google Scholar 

  4. Li, Y., Moon, K., Wong, C.P.: Science. 308, 1419–1420 (2005)

    Article  CAS  Google Scholar 

  5. Li, Y., Wong, C.P.: Mater. Sci. Eng. R. 51, 1–35 (2006)

    Article  CAS  Google Scholar 

  6. Liu, J. (ed.): Conductive Adhesives for Electronics Packaging. Electrochemical Publications, Isle of Man, Chapter 1 (1999)

    Google Scholar 

  7. Hwang, J.S. (ed.): Environment-Friendly Electronics: Lead-free Technology. Electrochemical Publications, Port Erin, Isle of Man, Chapter 1, pp. 4–10 (2001)

    Google Scholar 

  8. Murray, C.T., Rudman, R.L., Sabade, M.B., Pocius, A.V.: Mater. Res. Bull. 28, 449–454 (2003)

    Article  CAS  Google Scholar 

  9. Lau, J., Wong, C.P., Lee, N.C., Lee, S.W.R.: Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials. McGraw-Hill, New York (2002)

    Google Scholar 

  10. Lu, D., Tong, Q.K., Wong, C.P.: IEEE Trans. Compon. Packag. Manuf. Technol. Part C. 22(3), 228–232 (1999)

    CAS  Google Scholar 

  11. Persson, K., Nylund, A., Liu, J., Olefjord, I.: Proceedings of the 7th European Conference on Applications of Surface and Interface Analysis, Gothenburg (June 1997)

    Google Scholar 

  12. Lu, D., Wong, C.P.: J. Appl. Polym. Sci. 74, 399–406 (1999)

    Article  CAS  Google Scholar 

  13. Li, Y., Moon, K., Wong, C.P.: J. Adhes. Sci. Technol. 19(16), 1427–1444 (2005)

    Article  CAS  Google Scholar 

  14. Matienzo, L.J., Egitto, F.D., Logan, P.E.: J. Mater. Sci. 38, 4831–4842 (2003)

    Article  CAS  Google Scholar 

  15. Li, H., Moon, K., Wong, C.P.: J. Electron. Mater. 33, 106–113 (2004)

    Article  CAS  Google Scholar 

  16. Lu, D., Tong, Q.K., Wong, C.P.: IEEE Trans. Compon. Packag. Manuf. Technol. Part C. 22, 223–227 (1999)

    CAS  Google Scholar 

  17. Li, Y., Moon, K., Wong, C.P.: IEEE Trans. Compon. Packag. Manuf. Technol. 29(1), 173–178 (2006)

    Article  Google Scholar 

  18. Li, Y., Moon, K., Whitman, A., Wong, C.P.: IEEE Trans. Compon. Packag. Manuf. Technol. 29(4), 758–763 (2006)

    Article  CAS  Google Scholar 

  19. Gallagher, C., Matijasevic, G., Maguire, J.F.: Proceedings of 47th IEEE Electronic Components and Technology Conference, pp. 554–560 (1997)

    Google Scholar 

  20. Roman, J.W., Eagar, T.W.: Proceedings of the International Society for Hybrids and Microelectronics Society, San Francisco, CA, p. 52 (1992)

    Google Scholar 

  21. Li, Y., Moon, K., Li, H., Wong, C.P.: Proceedings of 54th IEEE Electronic Components and Technology conference, Las Vegas, Nevada, June 1–4, 2004 (1959–1964)

    Google Scholar 

  22. Cavasin, D., Brice-Heams, K., Arab, A.: Proceedings of 53rd Electronic Components and Technology Conference, pp. 1404–1407 (2003)

    Google Scholar 

  23. Kisiel, R.: J. Electron. Packag. 124, 367 (2002)

    Article  CAS  Google Scholar 

  24. de Vries, H., van Delft, J., Slob, K.: IEEE Trans. Compon. Packag. Manuf. Technol. 28, 499 (2005)

    Article  CAS  Google Scholar 

  25. Watanabe, I., Gotoh, Y., Kobayashi, K.: Proceedings of the Asia Display/IDW, Nagoya, Japan, pp. 553–556 (2001)

    Google Scholar 

  26. Nishida, H., Sakamoto, K., Ogawa, H.: IBM J. Res. Dev. 42, 517 (1998)

    Article  Google Scholar 

  27. Williams, D.J., Whalley, D.C., Boyle, O.A., Ogunjimi, A.O.: Solder. Surf. Mount Technol. 5, 4 (1993)

    Article  Google Scholar 

  28. Liu, J., Tolvgard, A., Malmodin, J., Lai, Z.: IEEE Trans. Compon. Packag. Manuf. Technol. 22, 186 (1999)

    Article  CAS  Google Scholar 

  29. Clot, P., Zeberli, J.F., Chenuz, J.M., Ferrando, F., Styblo, D.: Proceedings of the International Electronics Manufacturing Technology Symposium 24th IEEE/CPMT, Austin, TX, 36 (1999)

    Google Scholar 

  30. Wu, H., Wu, X., Liu, J., Zhang, G., Wang, Y., Zeng, Y., Jing, J.: Development of a novel isotropic conductive adhesive filled with silver nanowires. J. Compos. Mater. 40(21), 1961–1968 (2006)

    Article  CAS  Google Scholar 

  31. Chen, C., Wang, L., Li, R., Jiang, G., Yu, H., Chen, T.: J. Mater. Sci. 42(9), 3172 (2007)

    Article  CAS  Google Scholar 

  32. Lee, H.S., Chou, K.S., Shih, Z.W.: Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives. Int. J. Adhes. Adhes. 25, 437–441 (2005)

    Article  CAS  Google Scholar 

  33. Ye, L., Lai, Z., Liu, J., Tholen, A.: Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives. IEEE Trans. Electron. Packag. Manuf. 22(4), 299–302 (1999)

    Article  CAS  Google Scholar 

  34. Fan, L., Su, B., Qu, J., Wong, C.P., Electrical and thermal conductivities of polymer composites containing nano-sized particles. In: Proceedings of Electronic Components and Technology Conference. IEEE, NJ, pp. 148–154 (2004)

    Google Scholar 

  35. Jiang, H.J., Moon, K., Lu, J., Wong, C.P.: J. Electron. Mater. 34, 1432–1439 (2005)

    Article  CAS  Google Scholar 

  36. Jiang, H.J., Moon, K., Li, Y., Wong, C.P.: Surface functionalized silver nanoparticles for ultrahigh conductive polymer composites. Chem. Mater. 18(13), 2969–2973 (2006)

    Article  CAS  Google Scholar 

  37. Kotthaus, S., Günther, B.H., Haug, R., Schafer, H.: Study of isotropically conductive bondings filled with aggregates of nano-sized Ag-particles. IEEE Trans. Compon. Packag. Manuf. Technol. Part A. 20(1), 15–20 (1997)

    Article  CAS  Google Scholar 

  38. Das, R.N., Lauffer, J.M., Egitto, F.D.: Proceedings of Electronic Components and Technology Conference. IEEE, pp. 112–118 (2006)

    Google Scholar 

  39. Iijima, S.: Nature. 354, 56 (1991)

    Article  CAS  Google Scholar 

  40. Berber, S., Kwon, Y.K., Tomànek, D.: Unusually high thermal conductivity of carbon nanotubes. Phys. Rev. Lett. 84(20), 4613–4616 (2000)

    Article  CAS  Google Scholar 

  41. Yu, M.F., Files, B.S., Arepalli, S., Ruoff, R.S.: Tensile loading of ropes of single wall carbon nanotubes and their mechanical properties. Phys. Rev. Lett. 84(24), 5552–5555 (2000)

    Article  CAS  Google Scholar 

  42. Li, J., Lumpp, J.K.: Electrical and mechanical characterization of carbon nanotube filled conductive adhesive. In: Proceedings of Aerospace Conference. IEEE, NJ, pp. 1–6 (2006)

    Google Scholar 

  43. Qian, D., Dickey, E.C., Andrews, R., Rantell, T.: Load transfer and deformation mechanisms in carbon nanotube polystyrene composites. Appl. Phys. Lett. 76, 2868 (2000)

    Article  CAS  Google Scholar 

  44. Lin, X.C., Lin, F.: Improvement on the properties of silver-containing conductive adhesives by the addition of carbon nanotube. In: Proceedings of High Density Microsystem Design and Packaging. IEEE, NJ, pp. 382–384 (2004)

    Google Scholar 

  45. Rutkofsky, M., Banash, M., Rajagopal, R., Chen, J.: Using a carbon nanotube additive to make electrically conductive commercial polymer composites. Zyvex Corporation Application Note 9709. http://www.zyvex.com/Documents/9709.PDF 28 (2006)

  46. Kamyshny, A., Ben-Moshe, M., Aviezer, S., Magdassi, S.: Ink-jet printing of metallic nanoparticles and microemulsions. Macromol. Rapid Commun. 26, 281–288 (2005)

    Article  CAS  Google Scholar 

  47. Cibis, D., Currle U.: Inkjet printing of conductive silver paths. In: 2nd International Workshop on Inkjet Printing of Functional Polymers and Materials, Eindhoven (2005)

    Google Scholar 

  48. Kolbe, J., Arp, A., Calderone, F., Meyer, E.M., Meyer, W., Schaefer, H., Stuve, M.: Inkjettable conductive adhesive for use in microelectronics and microsystems technology. In: Proceedings of IEEE Polytronic Conference. IEEE, NJ, pp. 1–4 (2005)

    Google Scholar 

  49. Moscicki, A., Felba, J., Sobierajsk,i T., Kudzia, J., Arp, A., Meyer, W.: Electrically conductive formulations filled nano-size silver filler for ink-jet technology. In: Proceedings of IEEE Polytronic Conference. IEEE, NJ, pp. 40–44 (2005)

    Google Scholar 

  50. Wakuda, D., Hatamura, M., Suganuma, K.: Chem. Phys. Lett. 441, 305–308 (2007)

    Article  CAS  Google Scholar 

  51. Moon, K., Dong, H., Maric, R., Pothukuchi, S., Hunt, A., Li, Y., Wong, C.P.: J. Electron. Mater. 34, 132–139 (2005)

    Article  Google Scholar 

  52. Matsuba, Y.: Erekutoronikusu Jisso Gakkaishi. 6(2), 130–135 (2003)

    Article  CAS  Google Scholar 

  53. Li, Y., Moon, K., Wong, C.P.: J. Appl. Polym. Sci. 99(4), 1665–1673 (2006)

    Article  CAS  Google Scholar 

  54. Li, Y., Moon, K., Wong, C.P: Proceedings of 54th IEEE Electronic Components and Technology Conference. IEEE, NJ, pp. 1968–1974 (2004)

    Google Scholar 

  55. Li, Y., Wong, C.P: Proceedings of 55th IEEE Electronic Components and Technology Conference. IEEE, NJ, pp. 1147–1154 (2005)

    Google Scholar 

  56. Li, Y., Moon, K., Wong, C.P.: J. Electron. Mater. 34(3), 266–271 (2005)

    Article  CAS  Google Scholar 

  57. Li, Y., Moon, K., Wong, C.P.: J. Electron. Mater. 34(12), 1573–1578 (2006)

    Article  Google Scholar 

  58. Davies, G., Sandstrom, J.: Circuits Manuf. 56–62 (1976)

    Google Scholar 

  59. Harsanyi, G., Ripka, G.: Electrocomp. Sci. Technol. 11, 281–290 (1985)

    Article  Google Scholar 

  60. Giacomo, G.A.: In: McHardy, J., Ludwig, F. (eds.) Electrochemistry of Semiconductors and Electronics: Processes and Devices, pp. 255–295. Noyes Publications, Park Ridge (1992)

    Google Scholar 

  61. Manepalli, R., Stepniak, F., Bidstrup-Allen, S.A., Kohl, P.A.: IEEE Trans. Adv. Packag. 22, 4–8 (1999)

    Article  CAS  Google Scholar 

  62. Giacomo, D.: Reliability of Electronic Packages and Semiconductor Devices. McGraw- Hill, New York, Chapter 9 (1997)

    Google Scholar 

  63. Wassink, R.: Hybrid. Circ. 13, 9–13 (1987)

    CAS  Google Scholar 

  64. Shirai, Y., Komagata, M., Suzuki, K: 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. IEEE, NJ, pp. 79–83 (2001)

    Google Scholar 

  65. Der Marderosian, A.: Ratheon Co. Equipment Division, Equipment Development Laboratories, pp. 134–141 (1978)

    Google Scholar 

  66. Schonhorn, H., Sharpe, L.H.: Prevention of surface mass migration by a polymeric surface coating. US Patent 4377619 1983

    Google Scholar 

  67. Brusic, V., Frankel, G.S., Roldan, J., Saraf, R.: J. Electrochem. Soc. 142, 2591–2594 (1995)

    Article  CAS  Google Scholar 

  68. Wang, P.I., Lu, T.M., Murarka, S.P., Ghoshal, R.: US Pending Patent 20050236711 2005

    Google Scholar 

  69. Li, Y., Wong, C.P.: US Patent Pending, 2006

    Google Scholar 

  70. Li, Y., Wong, C.P.: Monolayer-protection for eletrochemical migration control in silver nanocomposite. Appl. Phys. Lett. 81, 112112 (2006)

    Article  CAS  Google Scholar 

  71. Prinz, G.A.: Science. 282, 1660 (1998)

    Article  CAS  Google Scholar 

  72. Toshioka, H., Kobayashi, M., Koyama, K., Nakatsugi, K., Kuwabara, T., Yamamoto, M., Kashihara, H.: SEI Tech. Rev. 62, 58–61 (2006)

    Google Scholar 

  73. Chang, D.C., Smith, E.L.: US patent #5206585 1993

    Google Scholar 

  74. Lieber, C.M.: Nanowire nanosensors for high sensitive and selective detection of biological and chemical species. Science. 293, 1289–1292 (2001)

    Article  Google Scholar 

  75. Martin, C.R., Menon, V.P.: Fabrication and evaluation of nanoelectrode ensembles. Anal. Chem. 67, 1920–1928 (1995)

    Article  Google Scholar 

  76. Xu, J.M.: Appl. Phys. Lett. 79, 1039–1041 (2001)

    Article  CAS  Google Scholar 

  77. Russell, T.P.: Ultra-high density nanowire array grown in self-assembled di-block copolymer template. Science. 290, 2126–2129 (2000)

    Article  Google Scholar 

  78. Li, Y., Moon, K., Wong, C.P.: Proceedings of 56th IEEE Electronic Components and Technology Conference. IEEE, NJ, pp.1239–1245 (2006)

    Google Scholar 

  79. Li, Y., Zhang, Z., Moon, K., Wong, C.P.: Ultra-fine pitch wafer level ACF (anisotropic conductive film) interconnect by in-situ formation of nano fillers with high current carrying capability. US Patent Pending 2006

    Google Scholar 

  80. Moon, K., Jiang, H., Zhang, R., Wong, C.: In-situ formed nanoparticles in polymer matrix for low pressure bonding. GTRC Invention Disclosure No. 4443 (2008)

    Google Scholar 

  81. Snow, E.S., Novak, J.P., Lay, M.D., Houser, E.H., Perkins, F.K., Campbell, P.M.: J. Vac.Sci. Technol. B. 22(4), 1990 (2004)

    Article  CAS  Google Scholar 

  82. Lay, M.D., Novak, J.P., Snow, E.S.: Nano Lett. 4(4), 603 (2004)

    Article  CAS  Google Scholar 

  83. Shiraishi, M., Takenobu, T., Iwai, T., Iwasa, Y., Kataura, H., Ata, M.: Chem. Phys. Lett. 394, 110 (2004)

    Article  CAS  Google Scholar 

  84. Meitl, M.A., Zhou, Y., Gaur, A., Jeon, S., Usrey, M.L., Strano, M.S., Rogers, J.A.: Nano Lett. 4(9), 1643 (2004)

    Article  CAS  Google Scholar 

  85. Zhou, Y., Gaur, A., Hur, S., Kocabas, C., Meitl, M.A., Shim, M., Rogers, J.A.: Nano Lett. 4(10), 2031 (2004)

    Article  CAS  Google Scholar 

  86. Li, Z., Dharap, P., Nagarajaiah, S., Barrera, E.V., Kim, J.D.: J. Adv. Mat. 16, 640 (2004)

    Article  CAS  Google Scholar 

  87. Abraham, J.K., Philip, B., Witchurch, A., Varadan, V.K., Reddy, C.C.: Smart Mater. Struct. 13, 1045 (2004)

    Article  CAS  Google Scholar 

  88. Wu, Z., Chen, Z., Du, X., Logan, J.M., Sippel, J., Nikolou, M., Kamaras, K., Reynolds, J.R., Tanner, D.B., Hebard, A.F., Rinzler, A.G.: Science. 305, 1273 (2004)

    Article  CAS  Google Scholar 

  89. Ferrer-Anglada, N., Kaempgen, M., Skákalová, V., Dettlaf-Weglikowska, U., Roth, S.: Diam. Relat. Mater. 13(2), 256 (2004)

    Article  CAS  Google Scholar 

  90. Hu, L., Zhoa, Y.-L., Ryu, K., Zhou, C., Stoddart, J.F., Grüner, G.: Adv. Mater. 20, 5939–5946 (2008)

    Google Scholar 

  91. Gruner, G.: J. Mater. Chem. 16, 3533–3539 (2006)

    Article  CAS  Google Scholar 

  92. Ago, H., Petritsch, K., Shaffer, M.S.P., Windle, A.H., Friend, R.H.: Adv. Mater. 11, 1281 (1999)

    Article  CAS  Google Scholar 

  93. Du Pasquier, A., Unalan, H.E., Kanwal, A., Miller, S., Chhowalla, M.: Appl. Phys. Lett. 87, 203511 (2005)

    Article  CAS  Google Scholar 

  94. Shan, B., Cho, K.: Phys. Rev. Lett. 94, 236602 (2005)

    Article  CAS  Google Scholar 

  95. Mitschke, U., Bauerle, P.: J. Mater. Chem. 10, 1471 (2000)

    Article  CAS  Google Scholar 

  96. Kaempgen, M., Duesberg, G.S., Roth, S.: Appl. Surf. Sci. 252, 425–429 (2005)

    Article  CAS  Google Scholar 

  97. Kaiser, A.B., Dusberg, G., Roth, S.: Phys. Rev. B. 57, 1418 (1998)

    Article  CAS  Google Scholar 

  98. Liu, K., Roth, S., Duesberg, G.S., Kim G.-T., Schmid M.: Progress in molecular nanostructures.In: Kuzmany H., Fnk J., Mehring M., Roth S. (eds.) American Institute of New York, AIP Conference Proceedings, vol. 442, pp. 61–64 (1998)

    Google Scholar 

  99. Shirashi, M.: Synth. Met. 9198, 1 (2002)

    Google Scholar 

  100. Duesberg, G.S., Graham, A.P., Kreupl, F., Liebau, M., Seidel, R., Under, E., Hönlein, W.: Diam. Rel. Mater. 13, 354 (2004)

    Article  CAS  Google Scholar 

  101. Lu, K.L., Lago, R.M., Chen, Y.K., Green, M.L.H., Harris, P.J.E., Tsang, S.C.: Carbon. 34, 814 (1996)

    Article  CAS  Google Scholar 

  102. Trancik, J.E., Barton, S.C., Hone, J.: Nano Lett. 8(4), 982–987 (2008)

    Article  CAS  Google Scholar 

  103. Ouyang, H.Y., Yang, Y.: Adv. Mater. 18, 2141–2144 (2006)

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Intel Corporation, Chandler, AZ, USA

    Yi Li, Kyoung-sik (Jack) Moon & C. P. (Ching-Ping) Wong

Authors
  1. Yi Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Kyoung-sik (Jack) Moon
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. C. P. (Ching-Ping) Wong
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Yi Li .

Editor information

Editors and Affiliations

  1. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    C. P.(Ching-Ping) Wong

  2. School of Materials Science & Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Kyoung-sik (Jack) Moon

  3. Intel Corp., Chandler, AZ, USA

    Yi Li

Rights and permissions

Reprints and permissions

Copyright information

© 2021 Springer Nature Switzerland AG

About this chapter

Check for updates. Verify currency and authenticity via CrossMark

Cite this chapter

Li, Y., Moon, Ks.(., Wong, C.P.(P. (2021). Nano-conductive Adhesives for Nano-electronics Interconnection. In: Wong, C.PP., Moon, Ks.(., Li, Y. (eds) Nano-Bio- Electronic, Photonic and MEMS Packaging. Springer, Cham. https://doi.org/10.1007/978-3-030-49991-4_2

Download citation

Publish with us

Policies and ethics

Search

Navigation