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Technological Advances and Challenges in Chemical Mechanical Polishing

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Advances in Abrasive Based Machining and Finishing Processes

Part of the book series: Materials Forming, Machining and Tribology ((MFMT))

Abstract

It has been already several decades since chemical mechanical polishing (CMP) process has been deployed as a planarization technique for the fabrication of integrated circuit (IC) in the semiconductor industries.  CMP is considered to be a wet polishing technique that has the capability to generate ultrafine surfaces for numerous materials using the combined effect of chemical and mechanical interactions. As CMP involves both mechanical and chemical actions, the process efficiency of CMP also varies with the parameters involved with mechanical and chemical aspects. This chapter presents an overview of CMP technology, working principles, its recent advancement status in terms of green slurry development, abrasives development, new polishing method, research trends and challenges.

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Author information

Authors and Affiliations

  1. Department of Mechanical Engineering, Çankaya University, Ankara, Turkey

    Samad Nadimi Bavil Oliaei

  2. Department of Mechanical and Aerospace Engineering, School of Engineering and Digital Sciences, Nazarbayev University, Nur-Sultan, Kazakhstan

    Muslim Mukhtarkhanov & Asma Perveen

Authors
  1. Samad Nadimi Bavil Oliaei
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  2. Muslim Mukhtarkhanov
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  3. Asma Perveen
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Corresponding author

Correspondence to Asma Perveen .

Editor information

Editors and Affiliations

  1. Department of Mechanical Engineering, Swami Vivekananda Institute of Science and Technology, Kolkata, India

    S. Das

  2. Department of Mechanical Engineering, Aliah University, Kolkata, India

    G. Kibria

  3. Department of Production Engineering, Jadavpur University, Kolkata, India

    B. Doloi

  4. Department of Production Engineering, Jadavpur University, Kolkata, India

    B. Bhattacharyya

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Nadimi Bavil Oliaei, S., Mukhtarkhanov, M., Perveen, A. (2020). Technological Advances and Challenges in Chemical Mechanical Polishing. In: Das, S., Kibria, G., Doloi, B., Bhattacharyya, B. (eds) Advances in Abrasive Based Machining and Finishing Processes. Materials Forming, Machining and Tribology. Springer, Cham. https://doi.org/10.1007/978-3-030-43312-3_10

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  • DOI: https://doi.org/10.1007/978-3-030-43312-3_10

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-43311-6

  • Online ISBN: 978-3-030-43312-3

  • eBook Packages: EngineeringEngineering (R0)

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