Device Parameter Variations in Microsystems Manufacturing

  • Michael Huff
Part of the Microsystems and Nanosystems book series (MICRONANO)


This chapter focuses on a major theme of this volume, namely, how to analyze the variations in device parameters that occur when using microsystems fabrication technologies. It is explained that parameter variations are important since they result in the device output differing from the expected device output behavior that is based on the design. Two different types of parameter variations are discussed: systematic (bias) variations and random variations. Bias variations are fixed amounts of offsets that occur in the device parameters, while random parameter variations are caused by non-systematic process variations. It is discussed that the magnitude of these parameter variations can significantly vary depending on the specific details of the equipment, process being performed, and the aggressiveness of the device dimensions. This chapter also covers the important concepts of precision and accuracy. Both are important for a well-controlled manufacturing process. The tools of statistical analysis are covered for both continuous and discrete probability distributions. Various examples are used to reinforce how these statistical methods can be effectively employed in analyzing the variations of the device output behavior using microsystems manufacturing. The material covered in this chapter will be used in the next chapter in explaining parametric yield analysis.


Manufacturing variations Relation variation(s) Bias variations Random variations Resolution, precision, and accuracy Tolerance(s) Worst-case analysis Method of moments Monte Carlo analysis 


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© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Michael Huff
    • 1
  1. 1.Corporation for National Research InitiativesMEMS & Nanotechnology ExchangeRestonUSA

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