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Microsystems Manufacturing Methods: MEMS Processes

  • Michael Huff
Chapter
  • 275 Downloads
Part of the Microsystems and Nanosystems book series (MICRONANO)

Abstract

Chapter 4 gives an overview of the processing steps and process modules used in MEMS manufacturing. Like IC fabrication, MEMS processing steps can be lumped into major categories including depositions; lithography; etching; impurity doping; etc. While MEMS fabrication shares a number of attributes with IC processing steps reviewed in Chap. 3, there are also a number of differences. In some cases, MEMS uses the same equipment as IC fabrication, with the distinguishing feature either that the material processed is not something used in IC manufacturing or some other attribute, such as the thickness of the film deposited is exclusive to MEMS. Additionally, there are some MEMS processing steps that are unique (i.e., are not performed in IC fabrication) and may use specialized equipment. Some MEMS fabrication methods, such as bulk micromachining, are better labeled as process modules rather than processing steps, and these are also described. The substrates used in MEMS manufacturing are also far more diverse than those used in IC manufacturing and are also reviewed. Lastly, as in Chap. 3, general guidance as the best-case expected dimensional variations that can be obtained in performing these MEMS processes is summarized in Table 4.2.

Keywords

Bulk micromachining Anisotropic wet etchants Etch stops Surface micromachining Wafer bonding Deep reactive ion etching Spray photoresist Lift-off LIGA Hot embossing 

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© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Michael Huff
    • 1
  1. 1.Corporation for National Research InitiativesMEMS & Nanotechnology ExchangeRestonUSA

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