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Microsystems Manufacturing Methods: Integrated Circuit Processing Steps

  • Michael Huff
Chapter
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Part of the Microsystems and Nanosystems book series (MICRONANO)

Abstract

A general overview of the processing steps commonly used in integrated circuit (IC) manufacturing is provided in Chap. 3. How each processing step is performed, the equipment commonly used, and guidance on the expected dimensional variations when performing the processing step are given. The subsequent chapter will focus on specialized processing steps used in MEMS fabrication. The major categories of processing steps used in IC fabrication include depositions or growths; lithography; etching; impurity doping; and metrology. Depending on the process sequence involved, there may also be other types of processing steps in the sequence as well such as planarization, rapid thermal anneals, and others. A number of these processing steps will be performed sequentially to implement the ICs, and some will be repeated multiple times. Once the fabrication is completed, the wafers will usually go through a series of tests to determine their functionality and performance. This is discussed in more detail in Chaps. 7, 8, and 9. Table 3.4 provides a compilation of the expected “best-case” dimensional variations for each of the processing steps reviewed in this chapter as a quick reference.

Keywords

Thin-film growth Thin-film deposition CVD ALD PVD Thermal diffusion Ion implantation Photolithography RTA CMP RIE Cleans 

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Copyright information

© Springer Nature Switzerland AG 2020

Authors and Affiliations

  • Michael Huff
    • 1
  1. 1.Corporation for National Research InitiativesMEMS & Nanotechnology ExchangeRestonUSA

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