Abstract
In this chapter, models for the heating in bond wires are presented. First, an analytic model is developed, which allows a fast characterisation of the bond wire properties, e.g., its time to failure. Secondly, a more accurate model using the finite integration technique for spatial discretisation is constructed. This model is also used to study the impact of manufacturing uncertainties, e.g., variable bond wire lengths, on the performance of bond wires.
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Guerra, D.J.D. et al. (2019). Bond Wire Models. In: ter Maten, E., Brachtendorf, HG., Pulch, R., Schoenmaker, W., De Gersem, H. (eds) Nanoelectronic Coupled Problems Solutions. Mathematics in Industry(), vol 29. Springer, Cham. https://doi.org/10.1007/978-3-030-30726-4_3
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DOI: https://doi.org/10.1007/978-3-030-30726-4_3
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Publisher Name: Springer, Cham
Print ISBN: 978-3-030-30725-7
Online ISBN: 978-3-030-30726-4
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