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Displaced Enhancement Devices and Wire Coil Inserts

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Insert Devices and Integral Roughness in Heat Transfer Enhancement

Part of the book series: SpringerBriefs in Applied Sciences and Technology ((BRIEFSTHERMAL))

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Abstract

This chapter has been presented with the heat transfer enhancement performance of displaced enhancement devices and wire coil inserts. Different correlations developed by researches across the world have been included. Experimental and numerical analysis for various insert configurations has been reported.

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Authors and Affiliations

  1. Mechanical Engineering Department, Indian Institute of Engineering Science and Technology, Shibpur, Howrah, West Bengal, India

    Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani & Anand Kumar Bharti

Authors
  1. Sujoy Kumar Saha
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  2. Hrishiraj Ranjan
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  3. Madhu Sruthi Emani
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  4. Anand Kumar Bharti
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Saha, S.K., Ranjan, H., Emani, M.S., Bharti, A.K. (2020). Displaced Enhancement Devices and Wire Coil Inserts. In: Insert Devices and Integral Roughness in Heat Transfer Enhancement. SpringerBriefs in Applied Sciences and Technology(). Springer, Cham. https://doi.org/10.1007/978-3-030-20776-2_3

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  • DOI: https://doi.org/10.1007/978-3-030-20776-2_3

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-20775-5

  • Online ISBN: 978-3-030-20776-2

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