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Monolithic 3D Integration—An Update

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Abstract

In Chips 2020 Vol. II we presented a review of Monolithic 3D technologies. In Sect. 3.3, titled “Precision Bonders—A Game Changer for Monolithic 3D,” we covered the impact of the then recent breakthrough in bonding alignment on the ease of adapting monolithic 3D technology. Since then, the equipment vendors have made significant improvements in the precision of these bonders, making it a very attractive technology for Monolithic 3D integration. At Semicon West 2018, EVG announced improvement of their precision bonders GEMINI® FB XT from 200 to 50 nm alignment precision. Such precision can support most currently envisioned monolithic 3D applications.

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  • DOI: 10.1007/978-3-030-18338-7_8
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Fig. 8.1
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Fig. 8.3

Source Applied Materials

Fig. 8.4
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Fig. 8.6

Source TSMC

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Correspondence to Zvi Or-Bach .

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Or-Bach, Z. (2020). Monolithic 3D Integration—An Update. In: Murmann, B., Hoefflinger, B. (eds) NANO-CHIPS 2030. The Frontiers Collection. Springer, Cham. https://doi.org/10.1007/978-3-030-18338-7_8

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