OP3DBFT: A Power and Performance Optimal 3D BFT NoC Architecture

  • Bheemappa HalavarEmail author
  • Basavaraj TalawarEmail author
Conference paper
Part of the Advances in Intelligent Systems and Computing book series (AISC, volume 940)


Network on Chips (NoC) have emerged as a reliable communication framework in CMPs and SoCs. Many 2-D NoC architectures have been proposed for efficient on-chip communication. The use of 3D IC technology in NoC promises to improve communication latency and power. Most of the 3D ICs use Through-silicon via (TSVs) as vertical interconnect. In this paper, we explore the design space of 2-layer 3D Butterfly Fat Tree (BFT) variants. Floorplan driven wire and TSV lengths are used to obtained power and performance optimal 3D NoC architectures. We analysed the performance of the output flow control using random and round robin output based deflection routing for 3D BFT variants. TSV based power and delay models were extended to a cycle accurate simulator to estimate accurate power and performance of 3D NoC architecture. We propose a new OP3DBFT (Optimal Power and Performance 3DBFT) architecture with round-robin deflection routing (RROD) as power and performance optimal 2-layer 3D NoC architecture. OP3DBFT has symmetric link lengths and 75% of TSVs count reduced compared to the regular 2-layer 3D BFT topology. Results of our experiments show that the performance improved up to 1.39\(\times \) and 1.3\(\times \) in OP3DBFT with fewer TSV counts compared to the regular 2-layer 3D BFT for uniform and transpose traffic respectively. The OP3DBFT NoC architecture EDP (Energy delay product) was lower by 40% for uniform traffic and 48% for transpose traffic.


3-D integration Network-on-chip (NoC) Through-silicon via (TSV) Interconnect 3D Butterfly Fat Tree 3D topology 


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© Springer Nature Switzerland AG 2020

Authors and Affiliations

  1. 1.Systems, Parallelization and Architecture Research Lab (SPARK-Lab)National Institute of Technology Karnataka SurathkalMangaloreIndia

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