Skip to main content

Fast Multi-parametric Method for Mechanical Properties Estimation of Clamped—Clamped Perforated Membranes

  • Conference paper
  • First Online:
Sensors (CNS 2018)

Abstract

The knowledge of material properties like Young’s modulus and residual stress is crucial for a reliable design of devices with optimized performance. Several works discussed on the determination of the mechanical properties of thin/thick films and microstructures from deflection measurements by a profiler. This work provides an approximate solution for the load-deflection response of perforated membranes clamped on two opposite edges subjected to quasi-point pressure loads applied by a profilometer. SixNy/a-Si/SixNy thin film membranes of different sizes and porosities were fabricated by unconventional 100 °C PECVD process using surface micromachining approach. Tri-layer thin films were mechanically characterized by nanoindentation tests and residual stress measurements based on the wafer curvature method. Load-deflection measurements were done by applying quasi-point loads in the range 4.9–9.8 μN. Finite Element Analysis was used to model the mechanical behavior of the membrane, in agreement with the deflection data measured by profilometer. The elastic modulus measured by nanoindentation was used as reference for the perforated membranes load-deflection analytical function identification. An approximate analytical law was developed, which explicates the maximum deflection amplitude as a function of geometric features (sizes and thickness) and mechanical properties (Young’s modulus and residual stress). It was validated numerically and experimentally; it was able to provide an estimation of the residual stress of CCFF perforated membranes, starting from measured data of deflection, for single or multiple loads; also, it can be used in a complementary way to calculate the Young’s modulus from deflection data and residual stress information.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Subscribe and save

Springer+ Basic
EUR 32.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or Ebook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 169.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book
USD 219.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Similar content being viewed by others

References

  1. Pan, J.Y., Lin, P., Maseeh, F., Senturia, S.D.: Verification of FEM analysis of load-deflection methods for measuring mechanical properties of thin films. In: Technical Digest IEEE Solid State Sensor and Actuators Workshop, Hilton Head Island, SC, 73, 70–73 (1990)

    Google Scholar 

  2. Malhaire, C.: Comparison of two experimental methods for the mechanical characterization of thin or thick films from the study of micromachined circular diaphragms. Rev. Sci. Instrum. 83, 055008 (2012)

    Article  Google Scholar 

  3. Tian, Y.B., Zhou, L., Zhong, Z.W., Sato, H., Shimizu, J.: Finite element analysis of deflection and residual stress on machined ultra-thin silicon wafers. Semicond. Sci. Technol. 26, 105002 (2011)

    Article  Google Scholar 

  4. Timoshenko, S., Woinowsky-Krieger, S.: Theory of Plates and Shells, 2nd edn. McGraw-Hill, Inc. (1959)

    Google Scholar 

  5. Eaton, W.P., Bitsie, F., Smith, J.H., Plummer, D.W.: A new analytical solution for diaphragm deflection and its application to a surface-micromachined pressure sensor. In: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems, Chapter 17, 640–643 (1999)

    Google Scholar 

  6. Kimiaeifar, A., Tolou, N., Barari, A., Herder, J.L.: Large deflection analysis of cantilever beam under end point and distributed loads. J. Chin. Inst. Eng. 37(4), 438–445 (2014)

    Article  Google Scholar 

  7. Stoney, G.G.: The tension of metallic films deposited by electrolysis. Proc. R. Soc. Lond. Ser. A 82(553), 172–175 (1909)

    Article  Google Scholar 

  8. Ugural, A.C.: Stress in Plates and Shells. McGraw-Hill, Boston (1999)

    Google Scholar 

  9. Kovacs, A., Pogany, M., Mescheder, U.: Mechanical investigation of perforated and porous membranes for micro- and nanofilter applications. Sens. Actuators B 127(1), 120–125 (2007)

    Article  Google Scholar 

  10. Rabinovich, V.L., Gupta, R.K., Senturia, S.D.: The effect of release-etch holes on the electromechanical behavior of MEMS structures. In: International Conference on Solid State Sensors and Actuators, TRANSDUCERS Chicago, IL, 2, 1125–1128 (1997)

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Chiara De Pascali .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2019 Springer Nature Switzerland AG

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Francioso, L., De Pascali, C., Bagolini, A., Duraccio, D., Siciliano, P. (2019). Fast Multi-parametric Method for Mechanical Properties Estimation of Clamped—Clamped Perforated Membranes. In: Andò, B., et al. Sensors. CNS 2018. Lecture Notes in Electrical Engineering, vol 539. Springer, Cham. https://doi.org/10.1007/978-3-030-04324-7_73

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-04324-7_73

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-04323-0

  • Online ISBN: 978-3-030-04324-7

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics