Abstract
This chapter explains various material removal pathways in relation to diamond polishing. The discussion here highlights the fact that the mechanisms for the removal of carbon atoms from a diamond substrate, which include the conversion of diamond to non-diamond carbon, chemical/mechanical removal, micro-cleavage, diffusion of carbon into soluble metals, chemical reactions, and removal of surface carbon atoms through evaporation, ablation or sputtering, are complicated. Individual diamond polishing processes can involve various mechanisms. Temperature rise plays an important role in the activation of almost all the mechanisms, as thermo-chemical reactions occur only at high temperatures. The fundamental understanding described in this chapter is of primary importance to an appropriate selection, design, and development of a sensible diamond polishing process.
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Chen, Y., Zhang, L. (2013). Understanding the Material Removal Mechanisms. In: Polishing of Diamond Materials. Engineering Materials and Processes. Springer, London. https://doi.org/10.1007/978-1-84996-408-1_2
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