Abstract
This chapter focuses on comparisons between conductive adhesives and solder pastes. First, plating technologies used by a quad flad pack component are compared using LIME. Then, the latest electric power and metal production LCI data from ecoinvent is used in earlier studies of high-temperature materials. As resource stress is one of the three pillars of life cycle product management, the third section explores the hidden resource flows by applying the ore-total material requirement model. The last section takes a look at future and Ag-free conductive adhesive material technologies. Moreover, traditional product level LCA (the relative LCAs for conductive adhesives) is scaled-up to global material flows to get a different distribution of the eco-profiles.
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(2010). LCAs of Pb Solders vs. Conductive Adhesives. In: Global Life Cycle Impact Assessments of Material Shifts. Springer, London. https://doi.org/10.1007/978-1-84882-661-8_6
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DOI: https://doi.org/10.1007/978-1-84882-661-8_6
Publisher Name: Springer, London
Print ISBN: 978-1-84882-660-1
Online ISBN: 978-1-84882-661-8
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