Abstract
In the previous chapters, we discussed in detail many facets of micro-relay technology: from device fabrication and operation to scaling and energy implications. While the previous discussion aimed to demonstrate the viability of micro-relays as an underlying technology, the next two chapters will demonstrate how micro-relays can be integrated into the existing CMOS design infrastructure. As mentioned earlier, one of the unspoken criterion for a CMOS replacement technology is that it be compatible with the extensive existing infrastructure that has been built around CMOS technology [1]. This implied requirement is largely the reason behind choosing to explore the use of a four-terminal micro-relay first, since it shares functional similarities with an MOS transistor. In particular, we will show how micro-relays can implement many of the same functional circuits as used in CMOS at a lower energy cost while using the same simulation and design tool environments.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
K. Bernstein, R.K. Cavin, W. Porod, A. Seabaugh, J. Welser, Device and architecture outlook for beyond CMOS switches. Proc. IEEE 98(12), 2169–2184 (2010)
J.M. Rabaey, A. Chandrakasan, B. Nikolic, Digital Integrated Circuits, 2nd edn. (Prentice Hall, Upper Saddle River, NJ, 2003)
P.R. Gray, P.J. Hurst, S.H. Lewis, R.G. Meyer, Analysis and Design of Analog Integrated Circuits, 5th edn. (John Wiley & Sons, New York, 2009)
T. Gabara, S. Knauer, Digitally adjustable resistors in CMOS for high-performance applications. IEEE J. Solid-State Circuits 2(8), 1176–1185 (1992)
M. Banu, Y. Tsividis, Fully integrated active RC filters in MOS technology, 1983 I.E. Int. Solid-State Circuits Conf. Dig. Tech. Pap., no. 6, pp. 244–245, 1983
L. Magnelli, F. Crupi, P. Corsonello, C. Pace, G. Iannaccone, S. Member, A 2.6 nW, 0.45 V temperature-compensated subthreshold CMOS voltage reference. IEEE J. Solid-State Circuits 46(2), 465–474 (2011)
A. Tajalli, E. Brauer, Subthreshold source-coupled logic circuits for ultra-low-power applications. IEEE J. Solid-State Circuits 43(7), 1699–1710 (2008)
L. Fay, V. Misra, R. Sarpeshkar, A micropower electrocardiogram amplifier. IEEE Trans. Biomed. Circuits Syst. 3(5), 312–20 (2009)
O.H. Schmitt, A thermionic trigger. J. Sci. Instrum. 15, 24–26 (1938)
R. Nathanael, V. Pott, H. Kam, J. Jeon, T.-J.K. Liu, 4-Terminal Relay Technology for Complementary Logic,” in IEDM, 2009, pp. 1–4
M. Spencer, F. Chen, C. Wang, R. Nathanael, H. Fariborzi, A. Gupta, H. Kam, V. Pott, J. Jeon, T.-J.K. Liu, D. Markovic, E. Alon, V. Stojanovic, Demonstration of integrated micro-electro-mechanical switch circuits for VLSI applications. IEEE J. Solid State Circuits 46(1), 308–320 (2011)
M. Spencer, Design considerations for nano-electromechanical relay VLSI, Ph.D. Thesis, University of California, Berkeley, 2014
R. Holm, Electric Contacts (Springer-Verlag, Berlin, 1967)
R. Maboudian, R.T. Howe, Critical review: adhesion in surface micromechanical structures. J. Vac. Sci. Technol. B Microelectron. Nanometer Struct. 15(1), 1–20 (1997)
D. Maugis, Contact, Adhesion and Rupture of Elastic Surfaces (Springer Verlag, Berlin, 2000)
D. Lee, V. Pott, H. Kam, R. Nathanael, T.-J.K. Liu, AFM characterization of adhesion force in micro-relays, in Micro Electro-Mechanical Systems (MEMS), 2010 I.E. 23rd International Conference, Jan. 2010, pp. 232–235
R. Nathanael, V. Pott, E. Alon, T.-J.K. Liu, Four-terminal-relay body-biasing schemes for complementary logic circuits. IEEE Electron. Dev. Lett. 31(8), 890–892 (2010)
R. Nathanael, Nano-Electro-Mechanical (NEM) Relay Devices and Technology for Ultra-Low Energy Digital Integrated Circuits (University of California, Berkeley, 2012)
H. Fariborzi, F. Chen, Design and demonstration of micro-electro-mechanical relay multipliers, in IEEE Asian Solid-State Circuits Conference, 2011, pp. 6–9
I. Sutherland, B. Sproull, D. Harris, Logical Effort: Designing Fast CMOS Circuits, 1st edn. (Morgan Kaufmann, San Francisco, 1999)
Predictive Technology Model. (Online), http://ptm.asu.edu/
F. Chen, H. Kam, D. Markovic, T.-J.K. Liu, V. Stojanovic, E. Alon, Integrated circuit design with NEM relays, in 2008 IEEE/ACM International Conference on Computer-Aided Design, 2008, pp. 750–757
W. Keister, The logic of relay circuits. Trans. Am. Inst. Electr. Eng. 68(1), 571–576 (1949)
Author information
Authors and Affiliations
Appendix: Micro-relay Verilog-A Model
Appendix: Micro-relay Verilog-A Model
The following text is an example of a micro-relay Verilog-A model, first used in [12], suitable for circuit simulation in either Spectre or HSPICE environments.
Rights and permissions
Copyright information
© 2015 Springer Science+Business Media New York
About this chapter
Cite this chapter
Kam, H., Chen, F. (2015). Integrated Circuit Design with Micro-relays. In: Micro-Relay Technology for Energy-Efficient Integrated Circuits. Microsystems and Nanosystems, vol 1. Springer, New York, NY. https://doi.org/10.1007/978-1-4939-2128-7_6
Download citation
DOI: https://doi.org/10.1007/978-1-4939-2128-7_6
Published:
Publisher Name: Springer, New York, NY
Print ISBN: 978-1-4939-2127-0
Online ISBN: 978-1-4939-2128-7
eBook Packages: EngineeringEngineering (R0)