Micro-relay Reliability

  • Hei Kam
  • Fred Chen
Part of the Microsystems and Nanosystems book series (MICRONANO, volume 1)


In this chapter, we provide a general overview and initial measurement studies of various failure modes for micro-relays, including structural fatigue, dielectric charging, contact surface oxidation, and welding-induced failure. We then use these results to establish the micro-relay design guidelines for applications such as digital logic and CMOS power gates.


Contact Temperature Switching Cycle Digital Logic Structural Fatigue Suspension Beam 
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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Hei Kam
    • 1
  • Fred Chen
    • 2
  1. 1.Intel CorporationHillsboroUSA
  2. 2.Lion Semiconductor, Inc.BerkeleyUSA

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