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Thermal Management, Design, and Analysis for WLCSP

  • Shichun Qu
  • Yong Liu
Chapter
  • 2.1k Downloads

Abstract

The operation of a wafer-level semiconductor device is sensitive to junction temperature. When the junction temperature exceeds the functional limit, the device does not operate in a normal way. It is also well known that the failure rates of semiconductor devices increase exponentially as the junction temperature rises. Figure 7.1 shows a FLIR camera image of temperature distribution inside a smart phone, which gives the sources of heat dissipation from WLCSPs mounted on the board. It is very crucial that the WLCSP designer and application engineer understand the definition, characteristics, and application of the thermal resistance of the WLCSP for proper device operation [1–6]. Power dissipation during the operation of the semiconductor device induces an increase in the junction temperature. This depends on the amount of power dissipation and the thermal resistance between the junction and the WLCSP bumps, an ambient, and some other specified reference point. This chapter introduces the thermal management, design, analysis, and cooling methods for WLCSP.

Keywords

Thermal Resistance Thermal Performance Junction Temperature Device Under Test Test Board 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Shichun Qu
    • 1
  • Yong Liu
    • 2
  1. 1.Fairchild SemiconductorSan JoseUSA
  2. 2.Fairchild SemiconductorSouth PortlandUSA

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