Fan-In Wafer-Level Chip-Scale Package

  • Shichun Qu
  • Yong Liu


Fan-in wafer-level chip-scale package is the first form of WLCSP. The term “fan-in” comes from the fact that early time WLCSP was originally designed as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.


Solder Joint Print Circuit Board Solder Ball Solder Bump Under Bump Metallization 
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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Shichun Qu
    • 1
  • Yong Liu
    • 2
  1. 1.Fairchild SemiconductorSan JoseUSA
  2. 2.Fairchild SemiconductorSouth PortlandUSA

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