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Fan-In Wafer-Level Chip-Scale Package

  • Shichun Qu
  • Yong Liu
Chapter
  • 2.2k Downloads

Abstract

Fan-in wafer-level chip-scale package is the first form of WLCSP. The term “fan-in” comes from the fact that early time WLCSP was originally designed as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.

Keywords

Solder Joint Print Circuit Board Solder Ball Solder Bump Under Bump Metallization 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Shichun Qu
    • 1
  • Yong Liu
    • 2
  1. 1.Fairchild SemiconductorSan JoseUSA
  2. 2.Fairchild SemiconductorSouth PortlandUSA

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