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WLCSP Typical Reliability and Test

  • Shichun Qu
  • Yong Liu
Chapter
  • 2.2k Downloads

Abstract

WLCSP is one of the fastest growing segments in semiconductor packaging industry due to the rapid advances in integrated circuit (IC) fabrication, small form factor, and low cost. This technology results in a lower cost per die (vs. traditional wirebond) when the die count per wafer is high. As the number of I/O per die increases (and thus the die size and the distance to neutral point increases), the WLCSP may not achieve prescribed solder joint reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.

Keywords

Solder Joint Solder Ball Solder Bump Drop Test Cohesive Zone Model 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  • Shichun Qu
    • 1
  • Yong Liu
    • 2
  1. 1.Fairchild SemiconductorSan JoseUSA
  2. 2.Fairchild SemiconductorSouth PortlandUSA

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