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Development of Miniature and Microminiaturized Electronic Packages

  • Walter Prise
Conference paper

Abstract

The packaging of electronic circuitry today is going through an evolutionary change in which old methods are being altered and new concepts are coming into existence. The field today could be divided into three categories:
  1. 1.

    High-density packaging.

     
  2. 2.

    Integrated circuitry.

     
  3. 3.

    Solid state and molecular electronics.

     

Keywords

Solid State Device Electronic Package Flat Statement Packaging Method Lead Material 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1962

Authors and Affiliations

  • Walter Prise
    • 1
  1. 1.Lockheed Missile and Space CompanySunnyvaleUSA

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