Abstract
This paper describes a microcircuit fabrication technique known as “Swiss Cheese.” Circuits are built up from pellet-shaped components without leads. The principal charm of the method is its extreme simplicity and flexibility. Compact, rugged design, which is compatible with automatic assembly, and the assurance of high reliability make this method advantageous.
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Hughes Publications on Microelectronics
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Bender, B.G., Dreyer, R.W. (1963). Status Report: “Swiss Cheese” Method of Circuit Packaging. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_27
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_27
Publisher Name: Springer, Boston, MA
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Online ISBN: 978-1-4899-7309-2
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