Abstract
This paper discusses three basic approaches to a simple and inexpensive, yet flexible, method for construction of analog circuitry. The unique features of cordwood geometry, pill components and multiple wafer components will be presented.
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References
W. B. Green, Westinghouse Thermoelectric Handbook, Westinghouse Electric Corporation, Youngwood, Pa., pp. 11–4 through 11–9; 1962.
F. R. Gleason, “First Interim Development Report for Miniature Thin-Film Inductors,” Motorola Inc., Solid State Electronics Department, Phoenix, Arizona; A.S.T.I.A., AD264344; September 22, 1961.
Wallmark and Marcus, “Minimum Size and Maximum Packing Density,” Proc. IRE, 50, 286–298; March 1962.
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© 1963 Springer Science+Business Media New York
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Slenker, S.A. (1963). High-Frequency Analog Circuitry. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_24
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_24
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7296-5
Online ISBN: 978-1-4899-7309-2
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