Packaging of Electronic Systems Utilizing Commercially Available Integrated Circuits

  • Frederick Bassett


An advanced packaging group has been in operation for the past year at Raytheon Company, Missile and Space Division. This company-sponsored program was originated specifically for the purpose of study and design of packaging concepts which utilized the latest practical developments in the electronic-component field.


Print Circuit Board Final Assembly Packaging Density Interconnection Pattern Packaging Efficiency 
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Copyright information

© Springer Science+Business Media New York 1963

Authors and Affiliations

  • Frederick Bassett
    • 1
  1. 1.Raytheon CompanyBedfordUSA

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