Advertisement

Packaging of Electronic Systems Utilizing Commercially Available Integrated Circuits

  • Frederick Bassett

Abstract

An advanced packaging group has been in operation for the past year at Raytheon Company, Missile and Space Division. This company-sponsored program was originated specifically for the purpose of study and design of packaging concepts which utilized the latest practical developments in the electronic-component field.

Keywords

Print Circuit Board Final Assembly Packaging Density Interconnection Pattern Packaging Efficiency 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer Science+Business Media New York 1963

Authors and Affiliations

  • Frederick Bassett
    • 1
  1. 1.Raytheon CompanyBedfordUSA

Personalised recommendations