Abstract
This paper describes a prefabricated weldable circuitry, Intercon, capable of use at all three packaging levels. A series of figures illustrates the various applications of Intercon.
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© 1963 Springer Science+Business Media New York
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McFadden, B.R. (1963). INTERCON—Prefabricated Weldable Circuitry. In: Rosine, L.L. (eds) Advances in Electronic Circuit Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-7309-2_10
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DOI: https://doi.org/10.1007/978-1-4899-7309-2_10
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-7296-5
Online ISBN: 978-1-4899-7309-2
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