The Heat-Sink Module
This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined, and manufacturing and maintenance considerations are discussed.
KeywordsHeat Sink Print Circuit Board Circuit Element Component Arrangement External Connection
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