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The Heat-Sink Module

  • R. E. Klein
  • J. Gammon
Conference paper

Abstract

This paper explains the bases for the design of a heat-sink module, a module desirable because of its great flexibility in component arrangement and adaptability to new usages. The methods by which the module would meet major design problems, such as heat management, standardization and internal flexibility, and component interconnection, are outlined, and manufacturing and maintenance considerations are discussed.

Keywords

Heat Sink Print Circuit Board Circuit Element Component Arrangement External Connection 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1965

Authors and Affiliations

  • R. E. Klein
    • 1
  • J. Gammon
    • 1
  1. 1.ITT Kellogg Communications SystemsChicagoUSA

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