Interconnection System

Abstract

The continued advancement of microminiature electronic equipment and the significant increase in the use of integrated circuits and thin films have created interconnection nightmares. In many cases the development of these new devices has outstripped interconnection technologies. With proper recognition and consideration of the six basic levels of interconnection—intramodule, module-to-motherboard, intramotherboard, motherboard-to-back-panel, back-panel wiring, and input—output—inherent interconnection and system design difficulties can be greatly minimized. By discussing new approaches and new ideas, Amphenol—Systems Packaging will present fresh concepts for the interconnection of microminiature systems and components. Subjects to be reviewed are interconnection and packaging of thin films and integrated circuits, new motherboarding techniques which minimize back wiring problems yet retain flexibility, and a new concept of simplified prepositioned weldable circuitry for microminiature interconnection applications.