Transfer Molding of Silicone Compounds for Environmental Protection of Electronic Modular Systems
Encapsulation of modular electronic circuitry by transfer molding has introduced a new packaging concept to the electronic industry. The combination of silicone molding compounds with modular circuitry has fulfilled the basic requirements for environmental protection of modular systems. Characteristics and advantages of these compounds, transfer molding techniques, and material processing are described in depth in this paper. Detailed information includes electrical characteristics, molding temperatures and pressures, and mold-design data.
KeywordsFlexural Strength Molding Temperature Silicone Compound Mold Design Molding Compound
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