Transfer Molding of Silicone Compounds for Environmental Protection of Electronic Modular Systems

  • Frederic J. Lockhart


Encapsulation of modular electronic circuitry by transfer molding has introduced a new packaging concept to the electronic industry. The combination of silicone molding compounds with modular circuitry has fulfilled the basic requirements for environmental protection of modular systems. Characteristics and advantages of these compounds, transfer molding techniques, and material processing are described in depth in this paper. Detailed information includes electrical characteristics, molding temperatures and pressures, and mold-design data.


Flexural Strength Molding Temperature Silicone Compound Mold Design Molding Compound 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer Science+Business Media New York 1965

Authors and Affiliations

  • Frederic J. Lockhart
    • 1
  1. 1.Dow Corning CorporationHemlockUSA

Personalised recommendations