Encapsulants for Electronic Packaging

Abstract

Many types and classes of embedding compounds are available for encapsulating electronic packages. For a particular application, an embedding compound must be selected that meets the design parameters, the electrical, mechanical, thermal, and environmental requirements. The factual property data necessary for such selection and the comparative advantages and disadvantages of the available encapsulating and potting compounds are tabulated and discussed. The problem of selecting a specific encapsulant for a particular electronic package currently being used in an aerospace application is presented. The matching of the design parameter, the electrical, mechanical, thermal, and environmental requirements to the electrical, physical, and thermal properties of the available embedding materials is described.