Skip to main content

Thermal Conductivity of Copper-Nickel and Silver-Palladium Alloy Systems

  • Chapter
Thermal Conductivity 14

Abstract

The recommended thermal conductivity values for copper-nickel and silver-palladium alloy systems are presented which cover the full range of alloy composition and temperature. The recommended values are based on both the critically evaluated experimental thermal conductivity data and the values obtained from methods developed for the calculation of the electronic and lattice thermal conductivities. The electronic thermal conductivity of an alloy is calculated from the electrical resistivity and thermoelectric power of the alloy and the electrical resistivity and thermal conductivity of the pure constituent elements. The lattice thermal conductivity is calculated semi-theoretically based upon the Klemens-Callaway theory.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 39.99
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 54.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Mott, N. F., Proc. Phys. Soc. (London), 47, 571 (1935).

    Article  CAS  Google Scholar 

  2. Mott, N. F. and Jones, H., The Theory of the Properties of Metals and Alloys, Clarendon Press, Oxford (1936)

    Google Scholar 

  3. Mott, N. F. and Jones, H., Dover Publications, New York, 196–8 (1958).

    Google Scholar 

  4. See the article by M. W. Ackerman, K. Y. Wu, and C. Y. Ho in this Proceedings.

    Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 1976 Springer Science+Business Media New York

About this chapter

Cite this chapter

Ho, C.Y., Ackerman, M.W., Wu, K.Y. (1976). Thermal Conductivity of Copper-Nickel and Silver-Palladium Alloy Systems. In: Klemens, P.G., Chu, T.K. (eds) Thermal Conductivity 14. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-3751-3_37

Download citation

  • DOI: https://doi.org/10.1007/978-1-4899-3751-3_37

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4899-3753-7

  • Online ISBN: 978-1-4899-3751-3

  • eBook Packages: Springer Book Archive

Publish with us

Policies and ethics