Some Considerations of the Kinetics and Thermodynamics of CVD Processes

  • Michael L. Hitchman
  • Waqar Ahmed
  • Sarkis Shamlian
  • Michael Trainor
Part of the NATO ASI Series book series (NSSB, volume 198)


For many years the growth by chemical vapour deposition of polycrystalline and amorphous layers of thin films for microelectronic applications was carried out in atmospheric pressure, cold wall reactors. At present the standard method for the growth of such layers in the semiconductor industry is by the use of low pressure (e.g. ~0.1–1 mbar) hot wall reactors1. Examples of layers currently being produced by LPCVD within the semiconductor industry include polysilicon, doped polysilicon, silicon dioxide, semi-insulating polysilicon (SIPOS), nitrogen enriched polysilicon, doped silicon dioxide and glasses, tungsten, aluminium, and silicides.


Flow Rate Ratio Dope Silicon Dioxide Wafer Edge Heterogeneous Rate Constant Dope Polysilicon 
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Copyright information

© Springer Science+Business Media New York 1989

Authors and Affiliations

  • Michael L. Hitchman
    • 1
  • Waqar Ahmed
    • 1
  • Sarkis Shamlian
    • 1
  • Michael Trainor
    • 1
  1. 1.Department of Pure and Applied ChemistryUniversity of StrathclydeGlasgowUK

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