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The Effect of γ-APS Substrate Modification Upon the Chemical Adhesion of Poly(Amic Acid-Imide) Films

  • D. J. Belton
  • A. Joshi
Part of the Polymer Science and Technology book series (POLS, volume 27)

Abstract

The chemical adhesion of poly(amic acid-imide), PAI, films upon silicon, silicon nitride, silicon dioxide and aluminum substrates was examined as a function of surface modification by γ-aminopropyltriethoxysilane, (γ-APS). In these systems it has been observed that curves describing the kinetics of PAI dissolution provide a useful means of discriminating differences in the solvent resistance of the PAI-substrate interphase. A ranking of the chemical adhesive interaction of PAI films on γ-APS modified substrates has been shown to go as Al<SixNy<Si<SiO2. This substrate effect has been shown to act in concert with an effect arising from the thickness of applied γ-APS layers. These two effects have been discussed in terms of coherence of the PAI-γ-APS-substrate interphase, short range γ-APS-substrate interactions, and the acid-base character of the substrate.

Keywords

Substrate Material Dissolution Behavior Amic Acid Chemical Adhesion Joint Life 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1985

Authors and Affiliations

  • D. J. Belton
    • 1
    • 2
  • A. Joshi
    • 1
    • 2
  1. 1.Philips Research Laboratories SunnyvaleSignetics Corp.SunnyvaleUSA
  2. 2.Lockheed Palo Alto Research LaboratoryPalo AltoUSA

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