Abstract
This paper reviews the major class of chip-to-chip interconnections used in high-performance computers and communication systems. The critical electrical characteristics are highlighted and the most beneficial type of measurement techniques are exemplified for cables, printed-circuit-boards, ceramic, thin-film, and on-chip wiring.
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© 1997 Springer Science+Business Media New York
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Deutsch, A. (1997). Broadband Characterization of Representative Circuit-To-Circuit Interconnections. In: Das, N.K., Bertoni, H.L. (eds) Directions for the Next Generation of MMIC Devices and Systems. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-1480-4_41
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DOI: https://doi.org/10.1007/978-1-4899-1480-4_41
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