Abstract
Metal interlayer deposition comprises a new family of wet-chemical processes by which a dense, electrically continuous metal film can be grown within the bulk of a pre-existing polymer film. The present article reviews three generic forms of the process, namely: electroless, polymer-mediated electrochemical, and carrier-mediated electrochemical deposition. Experimental examples are given with particular emphasis on polyimides as the matrix material. Mechanistic principles which govern the kinetics and morphology of the deposition are described.
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References
Permanent address: Department of Materials Science, Weizmann Institute of Science, Rehovot, Israel.
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Similar processes involving precipitation of other inorganic phases (BaSO4, AgCl, and Prussian Blue) have been studied.6 However, these processes are intrinsically self-limiting because the precipitated phase is impermeable to both reagents. By contrast, metal interlayer deposition is never self-limiting because the precipitate remains “permeable” to electrons.
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We are indebted to Dr. Ron Kander (Du Pont) for these calculations based on the Halpin-Tsai equations.
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Mazur, S., Manring, L.E., Levy, M., Dee, G.T., Reich, S., Jackson, C.E. (1989). Metal Interlayers in Polymer Films: A Survey of Deposition Processes, Morphology, Patterning Methods and Physical Properties. In: Mittal, K.L., Susko, J.R. (eds) Metallized Plastics 1. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0879-7_10
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DOI: https://doi.org/10.1007/978-1-4899-0879-7_10
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