Abstract
The influence of the chemical pre-treatment of commercial polyimide foil on the adhesion of copper deposited by electroless and electrochemical processes has been studied using SEM, XPS, EDX, and IR spectroscopy. The results show that a thin surface layer, chemically different from the pure material, is important for metal adhesion. This layer, which can be influenced by chemical etching, exhibits distinctly different features in the x-ray photoelectron spectrum.
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Horn, K., Ortega, A., Doblhofer, K., Bradshaw, A.M., Schulz, R., Meyer, H. (1991). Surface Pre-treatment and Metal Coating of Commercial Polyimide Studied by Surface Analytical Techniques. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_23
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DOI: https://doi.org/10.1007/978-1-4899-0735-6_23
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-0737-0
Online ISBN: 978-1-4899-0735-6
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