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Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper

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Metallized Plastics 2

Abstract

Three different model molecules, representative of selected parts of the polyimide monomer unit, phthalimide (PIM), methyl-phthalimide (MPIM), and benzene-phthalimide (BPIM), were deposited on polycrystalline copper in ultra high vacuum. Both thin films and stable adsorbates of these molecules were studied by means of angle-dependent X-ray photoelectron spectroscopy, XPS(θ). The interaction with the copper surface and the orientation of adsorbates appear to be very different for all three of the model molecules examined. PIM shows a preferential orientation and a pronounced interaction with the Cu surface via the nitrogen atom. MPIM forms a very stable adsorbate with an estimated thickness of 18 Å. The BPIM adsorbate decomposes on the Cu surface, which results in a large loss of nitrogen.

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© 1991 Springer Science+Business Media New York

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Bodö, P., Uvdal, K., Salaneck, W.R. (1991). Photoelectron Spectroscopy Model Study of the Interface Between Polyimide and Copper. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_15

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  • DOI: https://doi.org/10.1007/978-1-4899-0735-6_15

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4899-0737-0

  • Online ISBN: 978-1-4899-0735-6

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