Abstract
A chemical process for depositing copper films on polyimide substrates is described. The process is dependent upon the reversible electrochemical charge storage of polypyromellitimides in aqueous electrolytes and the reaction of these polymers with aqueous chemical reductants. The process is shown to be continuous, patternable, and produces metal films with high adhesion to the polymer substrate. The adhesion is, however, sensitive to relative humidity. Electrochemical characteristics of chemically and thermally cyclized polyimide are also outlined.
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© 1991 Springer Science+Business Media New York
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Krause, L.J., Speckhard, T.A. (1991). An Electrochemical Method of Polyimide Metallization. In: Mittal, K.L. (eds) Metallized Plastics 2. Springer, Boston, MA. https://doi.org/10.1007/978-1-4899-0735-6_1
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DOI: https://doi.org/10.1007/978-1-4899-0735-6_1
Publisher Name: Springer, Boston, MA
Print ISBN: 978-1-4899-0737-0
Online ISBN: 978-1-4899-0735-6
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