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8×8 GaAsP/GaP Led Arrays Fully Integrated with 64 Channel Si-Driver Circuits

  • R. Buß
  • M. Groß
  • T. Alder
  • W. Brockherde
  • D. Jäger

Abstract

We report on the realization of a hybrid photonic integrated circuit (PIC) consisting of an 8 × 8 array of vertical surface light emitting diodes flip-chip bonded to a 64 channel Si-CMOS driver circuit. Experimental results of the performance of both components are described. Pioneer applications considering interdisciplinary research are introduced.

Keywords

Solder Bump Microlens Array Optical Interconnect Lead Array Lead Driver 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 1997

Authors and Affiliations

  • R. Buß
    • 1
  • M. Groß
    • 1
  • T. Alder
    • 1
  • W. Brockherde
    • 2
  • D. Jäger
    • 1
  1. 1.Gerhard-Mercator-Universität DuisburgDuisburgGermany
  2. 2.Fraunhofer Institut IMSDuisburgGermany

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